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FIB/SEM Dual Beam Instrumentation: Slicing, Dicing, Imaging, and More

Published online by Cambridge University Press:  02 July 2020

Lucille A. Giannuzzi
Lucille A. Giannuzzi*
Affiliation:
Mechanical Materials & Aerospace Engineering, University of Central Florida, FL, 32816-2450
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Abstract

In a focused ion beam (FIB) instrument, ions (typically Ga+) obtained from a liquid metal ion source are accelerated down a column at energies up to ∽ 50 keV. The beam of ions is focused by electrostatic and octopole lens systems and the ion dose (and beam diameter) is controlled using real and/or virtual apertures. Beam sizes in FIB instruments on the order of 5-7 nm may be achieved.

The versatility of the FIB instrument enables large regions of material (e.g., 500 μm3) to be removed at high beam currents in just a couple of minutes. Lower beam currents (i.e., beam diameters) are usually used to remove smaller amounts of material within the same time frame (e.g., ∽ 5μm3). The introduction of an organometallic gas in close proximity to the target allows for the deposition of metals, SiO2, and other materials, by an ion beam assisted chemical vapor deposition process.

Type
Technologists’ Forum Special Topics: Dual Beam Instrumentation
Information
Microscopy and Microanalysis , Volume 7 , Issue S2: Proceedings: Microscopy & Microanalysis 2001, Microscopy Society of America 59th Annual Meeting, Microbeam Analysis Society 35th Annual Meeting, Long Beach, California August 5-9, 2001 , August 2001 , pp. 796 - 797
Copyright
Copyright © Microscopy Society of America 2001

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References

References:

[1]Giannuzzi, L.A. et al., Mat. Res. Soc. Symp. Proc. Vol. 480(1997)19–27.CrossRefGoogle Scholar
[2]Giannuzzi, L.A. et al., Microscopy Research and Technique, 41(1998)285–290.3.0.CO;2-Q>CrossRefGoogle ScholarPubMed
[3]Stevie, FA. et al., in press, Surface Interface Ananlysis.Google Scholar
[4]Microscopy & Microanalysis, 6 (Suppl 2: Proceedings), MSA (2000).Google Scholar
[5]Kempshall, B.W., in review, Journal of Vacuum Science & Technology.Google Scholar
[6]Urbanik, C.A. et al., Microscopy and Microanalysis,” 5, (suppl. 2: Proceedings), MSA, 99(1999)740–741.CrossRefGoogle Scholar
[7]Young, R.J., Microscopy & Microanalysis, 6 (Suppl 2: Proceedings), MSA (2000)512–513.CrossRefGoogle Scholar
[8]Young, RJ. et al., Proc. ISTFA, (1998)329Google Scholar
[9]Young, RJ. et al., presented at Microscopy & Microanalysis, Philadelphia, PA, Aug. 13–17, 2000.Google Scholar
[10]The support by NSF DMR #9703281 is gratefully acknowledged.Google Scholar