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Design and Initial Performance of an Ultrahigh Vacuum Sample Preparation Evaluation Analysis and Reaction (SPEAR) System

Published online by Cambridge University Press:  08 August 2003

C. Collazo-Davila ,
E. Landree ,
D. Grozea ,
G. Jayaram ,
R. Plass ,
P.C. Stair  and
L.D. Marks
C. Collazo-Davila
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
E. Landree
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
D. Grozea
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
G. Jayaram
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
R. Plass
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
P.C. Stair
Affiliation:
Department of Chemistry, Northwestern University, Evanston, Illinois 60208
L.D. Marks
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208
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Abstract

Results concerning the calibration and use of a new ultrahigh vacuum (UHV) surface preparation and analysis system are reported. This Sample Preparation Evaluation Analysis and Reaction (SPEAR) side chamber system replaces an older surface side chamber that was attached to a Hitachi UHV H-9000 microscope. The system combines the ability to prepare clean surfaces using sample heating, cooling, ion milling, or thin film growth with surface analytical tools such as Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM), along with atomic surface structure information available from high-resolution transmission electron microscopy (HREM). The chemical sensitivity of the XPS and AES are demonstrated in preliminary studies of catalytic and semiconductor samples. In addition, the surface preparation capabilities are also demonstrated for the Si(100) and Ge(100) surfaces, including the ability to acquire secondary electron images during milling. During operation, the entire system is capable of maintaining the UHV conditions necessary for surface studies.

Keywords

ultrahigh vacuum (UHV)transmission electron microscopy (TEM)surface sciencesurface analytical techniques
Type
Research Article
Information
Microscopy and Microanalysis , Volume 1 , Issue 6 , December 1995 , pp. 267 - 279
Copyright
© 1995 Microscopy Society of America

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