Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-24T16:49:33.686Z Has data issue: false hasContentIssue false
  • English
  • Français

Coupling Automated Electron Backscatter Diffraction with Transmission Electron and Atomic Force Microscopies

Published online by Cambridge University Press:  02 July 2020

A.J. Schwartz ,
M. Kumar ,
P.J. Bedrossian  and
W.E. King
M. Kumar
Affiliation:
Lawrence Livermore National Laboratory, Chemistry & Materials Science Directorate, L-355, P.O. Box 808, Livermore, CA, 94550USA
P.J. Bedrossian
Affiliation:
Lawrence Livermore National Laboratory, Chemistry & Materials Science Directorate, L-355, P.O. Box 808, Livermore, CA, 94550USA
W.E. King
Affiliation:
Lawrence Livermore National Laboratory, Chemistry & Materials Science Directorate, L-355, P.O. Box 808, Livermore, CA, 94550USA
Get access

Extract

Grain boundary network engineering is an emerging field that encompasses the concept that modifications to conventional thermomechanical processing can result in improved properties through the disruption of the random grain boundary network. Various researchers have reported a correlation between the grain boundary character distribution (defined as the fractions of “special” and “random” grain boundaries) and dramatic improvements in properties such as corrosion and stress corrosion cracking, creep, etc. While much early work in the field emphasized property improvements, the opportunity now exists to elucidate the underlying materials science of grain boundary network engineering. Recent investigations at LLNL have coupled automated electron backscatter diffraction (EBSD) with transmission electron microscopy (TEM)5 and atomic force microscopy (AFM) to elucidate these fundamental mechanisms.

An example of the coupling of TEM and EBSD is given in Figures 1-3. The EBSD image in Figure 1 reveals “segmentation” of boundaries from special to random and random to special and low angle grain boundaries in some grains, but not others, resulting from the 15% compression of an Inconel 600 polycrystal.

Type
Advances in the Instrumentation and Application of Electron Backscatter Diffraction in the SEM
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 940 - 941
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

References:

1.Palumbo, G., U.S. Patents 5,702,543 (1997) and 5,817,193 (1998).Google Scholar
2.Lechockey, E.M. at al, Metallurgical and Materials Transactions, 28A, (1998) 387.CrossRefGoogle Scholar
3.Was, G.S. et al., Journal of Metals, 50, No. 2 (1998) 44.Google Scholar
4.Kumar, M. et al., Advances in Twinning, TMS Annual Meeting, (1999) 13.Google Scholar
5. M. Kumar et al., Presented at MRS Fall Meeting, Interfacial Engineering, (1999).Google Scholar
6.Bedrossian, P.J. et al., MRS Fall Meeting, Interfacial Engineering, (1999) in press.Google Scholar
7. This work is performed under the auspices of the US Department of Energy by the Lawrence Livermore National Laboratory under contract W-7405-Eng-48. The authors wish to thank Mr. M. Wall, Ms. L. Nguyen, and Ms. A. Bliss for their technical support.Google Scholar