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Copper Refinement from Anode to Cathode and then to Wire Rod: Effects of Impurities on Recrystallization Kinetics and Wire Ductility

Published online by Cambridge University Press:  09 September 2015

Anne-Laure Helbert ,
Alice Moya ,
Tomas Jil ,
Michel Andrieux ,
Michel Ignat ,
François Brisset  and
Thierry Baudin
Anne-Laure Helbert
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, Bâtiment 410, 91405 Orsay Cedex, France
Alice Moya
Affiliation:
DIMEC, FCFM, U. de Chile and Codelco. Beauchef #850, Santiago, Chile
Tomas Jil
Affiliation:
DIMEC, FCFM, U. de Chile and Codelco. Beauchef #850, Santiago, Chile
Michel Andrieux
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, Bâtiment 410, 91405 Orsay Cedex, France
Michel Ignat
Affiliation:
DIMEC, FCFM, U. de Chile and Codelco. Beauchef #850, Santiago, Chile
François Brisset*
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, Bâtiment 410, 91405 Orsay Cedex, France
Thierry Baudin
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, Bâtiment 410, 91405 Orsay Cedex, France
*
*Corresponding author. [email protected]
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Abstract

In this paper, the traceability of copper from the anode to the cathode and then the wire rod has been studied in terms of impurity content, microstructure, texture, recrystallization kinetics, and ductility. These characterizations were obtained based on secondary ion mass spectrometry, differential scanning calorimetry (DSC), X-ray diffraction, HV hardness, and electron backscattered diffraction. It is shown that the recrystallization was delayed by the total amount of impurities. From tensile tests performed on cold drawn and subsequently annealed wires for a given time, a simplified model has been developed to link tensile elongation to the chemical composition. This model allowed quantification of the contribution of some additional elements, present in small quantity, on the recrystallization kinetics. The proposed model adjusted for the cold-drawn wires was also validated on both the cathode and wire rod used for the study of traceability.

Keywords

coppercathodeanodewirerecrystallizationductilitychemical impurities
Type
EMAS Special Issue
Information
Microscopy and Microanalysis , Volume 21 , Issue 5 , October 2015 , pp. 1153 - 1166
Copyright
© Microscopy Society of America 2015 

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