Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-12-01T09:02:17.138Z Has data issue: false hasContentIssue false
  • English
  • Français

The Application of SEM, FIB, LSM, AFM, and EDS Techniques During the Investigation of Failed Micromachined Elctronic Devices

Published online by Cambridge University Press:  02 July 2020

Jake Schaper ,
Theresa Hopson  and
Susan Brutcher
Jake Schaper
Affiliation:
Motorola Semiconductor Products Sector, Arizona Product Analysis Lab2100 E. Elliot Road, Tempe, AZ, 85284
Theresa Hopson
Affiliation:
Motorola Physical Sciences Research Labs, 2100 E. Elliot Road. , Tempe, AZ, 85284
Susan Brutcher
Affiliation:
Motorola Sensor Products Division, 5005 E. McDowell Road, Phoenix, AZ, 85008
Get access

Extract

Micromachined electronic devices present new challenges for established analytical tools in the semiconductor industry. These types of devices have moving components with spacing tolerances in the submicron domain. These spaces can be accumulation sites for mobile particles within the hermetically sealed device. Particles can then cause electrical malfunctions both random - for freely moving particles - and permanent - for entrapped particles. The problems for the failure analyst are: (1) a valid electrical test, (2) confirmation of the failure site without generating particles during the analysis; (3) the ability to locate and analyze known failure sites after the device is opened. A combination of several analytical tools are required for such tasks.

Surface micromachined devices are made by alternating layers of polysilicon and a sacrificial layer, such as oxide. To make a mechanical part from the deposited layer material, an underlying sacrificial layer is dissolved, thus freeing the element except where it is retained by an attachment to the silicon surface.

Type
Applications and Developments of Focused Ion Beams
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 538 - 539
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Bustillo, J., Howe, R., Muller, R., “Surface Micromachining for Microelectromechanical Systems”, Proceedings of the IEEE, Vol. 86, No. 8, 1998.CrossRefGoogle Scholar

2. Kovacs, G., Micromachined Transducers Sourcebook, McGraw Hill, 1998.Google Scholar

3. Schmidt, M., “Wafer-to-Wafer Bonding for Microstnicture Formation”, Proceedings of the IEEE, Vol. 86, No. 8, 1998.CrossRefGoogle Scholar

4. Handbook of Chemistry and Physics, CRC Press, 69th Ed. 1988-1989.Google Scholar