Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Kordás, K.
Nánai, L.
Bali, K.
Stépán, K.
Vajtai, R.
George, T.F.
and
Leppävuori, S.
2000.
Palladium thin film deposition from liquid precursors on polymers by projected excimer beams.
Applied Surface Science,
Vol. 168,
Issue. 1-4,
p.
66.
Kordás, K.
Nánai, L.
Galbács, G.
Uusimäki, A.
Leppävuori, S.
and
Bali, K.
2000.
Reaction dynamics of CW Ar+ laser induced copper direct writing from liquid electrolyte on polyimide substrates.
Applied Surface Science,
Vol. 158,
Issue. 1-2,
p.
127.
Kordás, K.
Békési, J.
Vajtai, R.
Jauhianen, M.
Remes, J.
Uusimäki, A.
Leppävuori, S.
George, Thomas F.
and
Nánai, L.
2001.
Laser-assisted via hole metallization in PCB materials.
Journal of Electronic Materials,
Vol. 30,
Issue. 5,
p.
L21.
Kordás, K.
Leppävuori, S.
Uusimäki, A.
George, Thomas F.
Nánai, L.
Vajtai, R.
Bali, K.
and
Békési, J.
2001.
Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating.
Thin Solid Films,
Vol. 384,
Issue. 2,
p.
185.
Kordás, K.
Békési, J.
Vajtai, R.
Nánai, L.
Leppävuori, S.
Uusimäki, A.
Bali, K.
George, Thomas F.
Galbács, G.
Ignácz, F.
and
Moilanen, P.
2001.
Laser-assisted metal deposition from liquid-phase precursors on polymers.
Applied Surface Science,
Vol. 172,
Issue. 1-2,
p.
178.
Pap, Andrea Edit
Kordás, Krisztián
Jantunen, Heli
Haapaniemi, Esa
and
Leppävuori, Seppo
2003.
Copper plating on and electrical investigation of a low-permittivity cycloolefin-copolymer.
Polymer Testing,
Vol. 22,
Issue. 6,
p.
657.
Charbonnier, M.
Romand, M.
Goepfert, Y.
Léonard, D.
and
Bouadi, M.
2006.
Copper metallization of polymers by a palladium-free electroless process.
Surface and Coatings Technology,
Vol. 200,
Issue. 18-19,
p.
5478.
Charbonnier, Marlène
Romand, Maurice
and
Goepfert, Yves
2006.
Ni direct electroless metallization of polymers by a new palladium-free process.
Surface and Coatings Technology,
Vol. 200,
Issue. 16-17,
p.
5028.
Charbonnier, M.
Romand, M.
Goepfert, Y.
Léonard, D.
Bessueille, F.
and
Bouadi, M.
2006.
Palladium (+2) reduction: A key step for the electroless Ni metallization of insulating substrates by a tin-free process.
Thin Solid Films,
Vol. 515,
Issue. 4,
p.
1623.
Byeon, Jeong Hoon
Park, Jae Hong
Yoon, Ki Young
and
Hwang, Jungho
2008.
Site-Selective Catalytic Surface Activation via Aerosol Nanoparticles for Use in Metal Micropatterning.
Langmuir,
Vol. 24,
Issue. 11,
p.
5949.
Ng, J.H.-G.
Desmulliez, M.P.Y.
Prior, K.A.
and
Hand, D.P.
2008.
Ultra-violet direct patterning of metal on polyimide.
Micro & Nano Letters,
Vol. 3,
Issue. 3,
p.
82.
Byeon, Jeong Hoon
Ko, Byung Ju
and
Hwang, Jungho
2008.
Catalytic Activation of Activated Carbon Fibers via Palladium Aerosol Nanoparticles for Use in Electroless Silver Deposition.
The Journal of Physical Chemistry C,
Vol. 112,
Issue. 10,
p.
3627.
Byeon, Jeong Hoon
and
Hwang, Jungho
2009.
Fabrication of a Metal Membrane on a Perforated Polymer Substrate by Palladium Aerosol Activation and Subsequent Electroless Plating.
ACS Applied Materials & Interfaces,
Vol. 1,
Issue. 2,
p.
261.