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Quantitative Measurements of Subcritical Debonding of Cu Films from Glass Substrates

Published online by Cambridge University Press:  03 March 2011

Mengzhi Pang  and
Shefford P. Baker
Mengzhi Pang
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, New York 14853-1501
Shefford P. Baker*
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, New York 14853-1501
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

A driver film method, in which a highly stressed overlayer is deposited to de-adhere a target film from a substrate, was developed to study the subcritical debonding behavior of Cu films from glass substrates. The driving force for debonding along Cu/glass interfaces was varied by depositing Cr overlayers to a range of thicknesses. One-dimensional crack growth was achieved by using C release layers and cutting strips from blanket films. Crack velocities, v, were measured and a wide strip solution was developed to obtain strain energy release rates, G. The Cu/Cr strips delaminated in a highly reproducible way, generating v–G plots similar to those seen in stress-corrosion cracking of bulk glass. Small variations in the amount of oxygen incorporated into the films during deposition strongly affected delamination rates. A reaction rate model for subcritical cracking by hydroxylation of the surfaces suggests that changes in oxygen content change the density of strong Cu–O–Si bonds across the interface.

Keywords

AdhesionBondingThin film
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 9 , September 2005 , pp. 2420 - 2431
Copyright
Copyright © Materials Research Society 2005

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