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Erratum: “Thermal Stability Enhancement in Nanostructured Cu Films Containing Insoluble Tungsten Carbides for Metallization” [J. Mater. Res. 20, 1379 (2005)]

Published online by Cambridge University Press:  01 August 2005

J.P. Chu ,
Y.Y. Hsieh ,
C.H. Lin  and
T. Mahalingam
J.P. Chu
Affiliation:
Institute of Materials Engineering, National Taiwan Ocean University, Keelung 202, Taiwan
Y.Y. Hsieh
Affiliation:
Institute of Materials Engineering, National Taiwan Ocean University, Keelung 202, Taiwan
C.H. Lin
Affiliation:
Institute of Materials Engineering, National Taiwan Ocean University, Keelung 202, Taiwan
T. Mahalingam
Affiliation:
Institute of Materials Engineering, National Taiwan Ocean University, Keelung 202, Taiwan

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Type
Errata
Information
Journal of Materials Research , Volume 20 , Issue 8 , August 2005 , pp. 2235
Copyright
Copyright © Materials Research Society 2005