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Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films

Published online by Cambridge University Press:  31 January 2011

Jae Yong Song  and
Jin Yu
Jae Yong Song*
Affiliation:
Division of Advanced Technology, Korea Research Institute of Standards and Science, Yuseong-gu, Daejeon 305-340, Korea
Jin Yu
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Yuseong-gu, Daejeon 305-701, Korea
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Phase transformations in SnAg–Ni80P20 films were studied ex situ in parallel with in situ measurements of the corresponding transformation-induced stresses. Layered formation of Ni3Sn4 and Ni3P phases at an early stage of a reaction between SnAg and Ni80P20 films resulted in a tensile stress similar to the stress evolution in Sn–Ni80P20 films, despite the additional formation of Ag3Sn phase. Ag3Sn phase did not significantly affect the degree of stress evolution because of its islandlike and sporadic formation on the top surface of the Ni3Sn4 layer. Isothermal annealing showed that compressive stress, which was induced by the dominant formation of Ni3Sn4, developed after an initial evolution of tensile stress.

Keywords

Phase transformationStress/strain relationshipThin film
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 2 , February 2009 , pp. 482 - 486
Copyright
Copyright © Materials Research Society 2009

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References

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