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Fabrication, structure, and property of epoxy-based composites with metal–insulator core–shell structure fillers

Published online by Cambridge University Press:  25 September 2013

Yujuan Niu ,
Yuanyuan Bai ,
Ke Yu ,
Li He ,
Feng Xiang  and
Hong Wang
Yujuan Niu
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
Yuanyuan Bai
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
Ke Yu
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
Li He
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
Feng Xiang
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
Hong Wang*
Affiliation:
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education and International Center for Dielectric Research, Department of Electronic Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The Ag@SiO2 core–shell structure nanoparticles prepared by chemical method were dispersed into epoxy matrix. By comparing with the epoxy-based composites filled with the mixed Ag and SiO2 nanoparticles (Ag + SiO2), it is found that the Ag@SiO2 core–shell structure fillers had important effects on the improved dielectric properties of the Ag@SiO2/epoxy composites. The core–shell structure fillers introduce a duplex interfacial polarization and a small number of free charge carriers, which enhance the dielectric permittivity of the composites. At the same time, the insulating SiO2 shell layer changes the interfacial interaction between the Ag filler and the epoxy matrix, not only avoiding Ag particles to connect directly and aggregate together but also providing a rough surface to contact with the epoxy host, which enhances the compatibility between the Ag@SiO2 fillers and the epoxy matrix. As the Ag@SiO2 packing ratio increases, the permittivity of the composites straightly increases and the loss tangent decreases, reaching the maximum and minimum respectively with the filler loading up to 60%.

Keywords

compositescore/shelldielectric properties
Type
Articles
Information
Journal of Materials Research , Volume 28 , Issue 18 , 28 September 2013 , pp. 2644 - 2649
Copyright
Copyright © Materials Research Society 2013 

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