Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-28T11:28:21.320Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of residual stress on the fracture strength of columnar TiN films

Published online by Cambridge University Press:  31 January 2011

S.J. Suresha ,
R. Gunda ,
V. Jayaram  and
S.K. Biswas
S.J. Suresha
Affiliation:
Materials Research Centre, Indian Institute of Science, Bangalore-560012, India
R. Gunda
Affiliation:
Department of Mechanical Engineering, Indian Institute of Science, Bangalore-560012, India
V. Jayaram*
Affiliation:
Materials Research Centre and Department of Materials Engineering, Indian Institute of Science, Bangalore-560012, India
S.K. Biswas
Affiliation:
Materials Research Centre and Department of Mechanical Engineering, Indian Institute of Science, Bangalore-560012, India
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The intercolumnar fracture strength of a columnar TiN film was deconvoluted by nanoindentation load-displacement curves. The columnar boundary strength of such films strongly depends on the amount of residual stress present in the film. The residual stress of the coating was modified by plastically stretching the substrate. Indentation studies on the columnar TiN coating as a function of residual stress reveals that the column sliding stress diminishes with residual stress, suggesting that the presence of a high compressive stress substantially improves the fracture strength of a columnar TiN film. True film hardness on the other hand does not change.

Keywords

Thin filmFractureHardness
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 12 , December 2007 , pp. 3501 - 3506
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Bendavid, A., Martin, P.J., Netterfield, R.P.Kinder, T.J.: The properties of TiN films deposited by filtered arc evaporation. Surf. Coat. Technol. 70, 97 1994CrossRefGoogle Scholar
2Oettel, H.Weidmann, R.: Residual stresses in PVD hard coatings. Surf. Coat. Technol. 76–77, 265 1995CrossRefGoogle Scholar
3Mani, A., Aubert, P., Mercier, F., Khodja, H., Berthier, C.Houdy, P.: Effects of residual stress on the mechanical and structural properties of TiC thin films grown by RF sputtering. Surf. Coat. Technol. 194, 190 2005CrossRefGoogle Scholar
4Gunnars, J.Alahelisten, A.: Thermal stresses in diamond coatings and their influence on coating wear and failure. Surf. Coat. Technol. 80, 303 1996CrossRefGoogle Scholar
5Karlsson, L., Hultman, L.Sundgren, J-E.: Influence of residual stresses on the mechanical properties of TiCxN1−x(x = 0, 0.15, 0.45) thin films deposited by arc evaporation. Thin Solid Films 371, 167 2000CrossRefGoogle Scholar
6Martin, P.J., Bendavid, A.Kinder, T.J.: Control of film properties during filtered arc deposition. Surf. Coat. Technol. 81, 36 1996CrossRefGoogle Scholar
7Ahlgren, M.Blomqvist, H.: Influence of bias variation on residual stress and texture in TiAlN PVD coatings. Surf. Coat. Technol. 200, 157 2005CrossRefGoogle Scholar
8Bielawski, M.: Residual stress control in TiN/Si coatings deposited by unbalanced magnetron sputtering. Surf. Coat. Technol. 200, 3987 2006CrossRefGoogle Scholar
9Shen, Y.G., Mai, Y.W., McKenzie, D.R., Zhang, Q.C., McFall, W.D.McBride, W.E.: Composition, residual stress, and structural properties of thin tungsten nitride films deposited by reactive magnetron sputtering. J. Appl. Phys. 88, 1380 2000CrossRefGoogle Scholar
10Abadias, G., Tse, Y.Y., Guérin, Ph.Pelosin, V.: Interdependence between stress, preferred orientation, and surface morphology of nanocrystalline TiN thin films deposited by dual ion beam sputtering. J. Appl. Phys. 99, 113519 2006CrossRefGoogle Scholar
11Almer, J., Odén, M.Håkansson, G.: Microstructure, stress and mechanical properties of arc-evaporated Cr–C–N coatings. Thin Solid Films 385, 190 2001CrossRefGoogle Scholar
12Liungcrantz, H., Hultman, L., Sundgren, J-E.Karlsson, L.: Ion induced stress generation in arc-evaporated TiN films. J. Appl. Phys. 78(2), 832 1995CrossRefGoogle Scholar
13Inoue, S., Ohba, T., Takata, H.Koterazawa, K.: Effect of partial pressure on the internal stress and the crystallographic structure of r.f. reactive sputtered Ti–N films. Thin Solid Films 343–344, 230 1999CrossRefGoogle Scholar
14Sato, K., Ichimiya, N., Kondo, A.Tanaka, Y.: Microstructure and mechanical properties of cathodic arc ion-plated (Al,Ti)N coatings. Surf. Coat. Technol. 163–164, 135 2003CrossRefGoogle Scholar
15Cozza, R.C., Tanaka, D.K.Souza, R.M.: Micro-abrasive wear of DC and pulsed DC titanium nitride thin films with different levels of film residual stresses. Surf. Coat. Technol. 201, 4242 2006CrossRefGoogle Scholar
16Combadiere, L.Machet, J.: Reactive magnetron sputtering deposition of TIN films. II. Influence of substrate temperature on the mechanical properties of the films. Surf. Coat. Technol. 88, 28 1996CrossRefGoogle Scholar
17Bhowmick, S., Xie, Z-H., Hoffman, M., Jayaram, V.Biswas, S.K.: Nature of contact deformation of TiN films on steel. J. Mater. Res. 19, 2616 2004CrossRefGoogle Scholar
18Bhowmick, S., Jayaram, V.Biswas, S.K.: Deconvolution of fracture properties of TiN films on steels from nanoindentation load-displacement curves. Acta Mater. 53, 2459 2005CrossRefGoogle Scholar
19Xie, Z-H., Hoffman, M., Moon, R.J.Munroe, P.R.: Deformation of a hard coating on ductile substrate system during nanoindentation: Role of the coating microstructure J. Mater. Res. 21, 437 2006CrossRefGoogle Scholar
20Tsui, T.Y., Oliver, W.C.Pharr, G.M.: Influences of stress on the measurement of mechanical properties using nanoindentation: Part I. Experimental studies in an aluminum alloy. J. Mater. Res. 11, 752 1996CrossRefGoogle Scholar
21Oliver, W.C.Pharr, G.M.: An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 1992CrossRefGoogle Scholar
22Bolshakov, A., Oliver, W.C.Pharr, G.M.: Influences of stress on the measurement of mechanical properties using nanoindentation: Part II. Finite element simulations. J. Mater. Res. 11, 760 1996CrossRefGoogle Scholar
23Stoney, G.G.: The tension of metallic films deposited by electrolysis. Proc. R. Soc. A, 82, 172 1909CrossRefGoogle Scholar
24Meng, W.J.Eesley, G.L.: Growth and mechanical anisotropy of TiN thin films. Thin Solid Films 271, 108 1995CrossRefGoogle Scholar
25Fillit, R.Y.Perry, A.J.: Residual stress and x-ray elastic constants in highly textured physically vapor deposited coatings. Surf. Coat. Technol. 36, 647 1988CrossRefGoogle Scholar
26Kese, K.O., Li, Z.C.Bergman, B.: Method to account for true contact area in soda-lime glass during nanoindentation with the Berkovich tip. Mater. Sci. Eng., A 404, 1 2005CrossRefGoogle Scholar
27Aldareguia, J.M. Molina, Lloyd, S.J., Oden, M., Joelsson, T., Hultman, L.Clegg, W.J.: Deformation structures under indentations in TiN/NbN single-crystal multilayers deposited by magnetron sputtering at different bombarding ion energies. Philos. Mag. A 82, 1983 2002CrossRefGoogle Scholar