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Cubic phase stabilization and improved dielectric properties of atomic-layer-deposited EryHf1-yOx thin films

Published online by Cambridge University Press:  31 January 2011

K.B. Jinesh*
Affiliation:
NXP Semiconductor Research, High-Tech Campus 4, 5656 AE, Eindhoven, The Netherlands; and Holst Centre (IMEC), 5605 KN Eindhoven, The Netherlands
Y. Lamy
Affiliation:
NXP Semiconductor Research, High-Tech Campus 4, 5656 AE, Eindhoven, The Netherlands; and CEA-LETI, Grenoble 38054, France
E. Tois
Affiliation:
ASM Microchemistry Ltd., Väinö Auerin Katu 12 A, FIN-00560 Helsinki, Finland
R. Forti
Affiliation:
NXP Semiconductor Research, High-Tech Campus 4, 5656 AE, Eindhoven, The Netherlands
H.J. Wondergem
Affiliation:
Philips–MiPlaza Material Analysis, High Tech Campus 11, 5656 AE Eindhoven, The Netherlands
W.F.A. Besling
Affiliation:
NXP Semiconductor Research, High-Tech Campus 4, 5656 AE, Eindhoven, The Netherlands
F. Roozeboom
Affiliation:
NXP Semiconductor Research, High-Tech Campus 4, 5656 AE, Eindhoven, The Netherlands; and Department of Applied Physics, Eindhoven University of Technology, 5600 MB Eindhoven, The Netherlands
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The electrical and physical properties of atomic-layer-deposited EryHf1-yOx thin films have been investigated with different stoichiometries of erbium oxide (Er2O3) and hafnium oxide (HfO2). The as-deposited and annealed EryHf1-yOx films exhibit much higher dielectric constants than the reported k-values of the corresponding binary oxides. The highest k-value of 37.6 ± 1 is achieved with 13 at.% of erbium in the film. The enhancement in dielectric constant is due to the formation of the cubic HfO2 phase stabilized by erbium, as revealed by x-ray diffraction experiments. The annealed mixed oxide films exhibit remarkably low oxide charges, low interface states, low leakage, and good breakdown electric fields.

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Articles
Copyright
Copyright © Materials Research Society 2010

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References

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