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Series:   Elements in Flexible and Large-Area Electronics

Hybrid Systems-in-Foil

Published online by Cambridge University Press:  14 September 2021

Mourad Elsobky  and
Joachim N. Burghartz
Mourad Elsobky
Affiliation:
IMS CHIPS
Joachim N. Burghartz
Affiliation:
IMS CHIPS

Summary

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
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Keywords

Hybrid System-in-Foilflexible electronicsultrathin chipChipFilm Patchelectronic skin
Type
Element
Information
Series: Elements in Flexible and Large-Area Electronics
Online ISBN: 9781108985116
Publisher: Cambridge University Press
Print publication: 14 October 2021

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